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Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
View  |  Adobe PDF(3448Kb)  |  Favorite  |  View/Download:335/169  |  Submit date:2020/03/11
Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download:330/184  |  Submit date:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis