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Indexed By：SCI
Source Publication：MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
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Effects of thermal aging on the cyclic thermal shock behavior of oxide/oxide ceramic matrix composites
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 769, 页码: 8
Authors:
Yang ZM(杨正茂)
;
Liu H
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Submit date：2020/03/11
Ceramic matrix composites
Cyclic thermal shocks
Thermal aging
Hierarchical porosity
Strain energy release rate
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:
Song M
;
Wei ZQ(魏志全)
;
Wang BY
;
Chen L
;
Chen L
;
Szpunar JA
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View/Download：325/182
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Submit date：2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis
