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Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
Authors:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  Favorite  |  View/Download：992/396  |  Submit date：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni  
Microstructural evolution and formation of nanocrystalline intermetallic compound during surface mechanical attrition treatment of cobalt 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 17, 页码: 5768-5779
Authors:  Wu XL(武晓雷);  Tao NR;  Wei QM;  Jiang P;  Lu J;  Lu K;  Wu, XL (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
Adobe PDF(1594Kb)  |  Favorite  |  View/Download：693/164  |  Submit date：2009/08/03
Nanocrystalline Materials  Diffusion  Intermetallics  Surface Mechanical Attrition  Severe Plastic-deformation  High-pressure Torsion  Triple Junctions  Nanostructured Materials  Magnetic-properties  Enhanced Diffusion  Self-diffusion  Pipe Diffusion  Alloys  Dislocations