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Molecular Dynamics Simulation of Microcrack Healing in Copper 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2001, 卷号: 20, 期号: 2, 页码: 143-150
Authors:  Li S;  Gao KW;  Qiao LJ;  Zhou FX(周富信);  Chu WY;  Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
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Microcrack Healing  Molecular Dynamics Simulation  Dislocation  Cu