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Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
Authors:  Wang Q;  NieY;  Shao YF(邵颖峰);  LiuHZ;  HuXQ;  LiDZ
Adobe PDF(18909Kb)  |  Favorite  |  View/Download：246/35  |  Submit date：2022/03/28
Ultrasound  Solid phase welding  Plastic deformation  Amorphous  Intermetallic compound  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：324/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis