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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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力学所知识产出(19... [1]
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汪海英 [1]
白以龙 [1]
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Creator：白以龙
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Date Issued：2002
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Flip Chip Technologies and Their Applications in MEMS Packaging
期刊论文
International Journal of Nonlinear Sciences and Numerical Simulation, 2002, 卷号: 3, 期号: 3-4, 页码: 433-436
Authors:
Wang HY(汪海英)
;
Bai YL(白以龙)
;
Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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Submit date：2007/06/15
