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Creator：Wang GY
First author
Creator：Yang XS
Date Issued：2016
Funding Organization：This work was supported by the General Research Fund (Project number, 622911) from the Hong Kong Research Grants Council. T.Y.Z. is grateful for the financial support by the research grant (No.14DZ2261200) from the Science and Technology Commission of Shanghai Municipality. Y.J.W and L.H.D acknowledge the financial supports from the NSFC (Nos. 11132011, 11402269, 11472287), the National Key Basic Research Program of China (No. 2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams. G.Y. W thanks the National Nature Science Foundation (grant No. 51401083).
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Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations
期刊论文
ACTA MATERIALIA, 2016, 卷号: 108, 页码: 252-263
Authors:
Yang XS
;
Wang YJ(王云江)
;
Wang GY
;
Zhai HR
;
Dai LH(戴兰宏)
;
Zhang TY
;
Zhang, TY (reprint author), Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
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Submit date：2016/09/14
Stress Relaxation
Nanotwin
Copper
Hrtem
Atomistic Simulations
