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Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
Adobe PDF(3448Kb)  |  Favorite  |  View/Download：335/169  |  Submit date：2020/03/11
Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
Adobe PDF(5717Kb)  |  Favorite  |  View/Download：330/184  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
In-situ observation of dislocation dynamics near heterostructured interfaces 期刊论文
MATERIALS RESEARCH LETTERS, 2019, 卷号: 7, 期号: 9, 页码: 376-382
Authors:  Zhou H;  Huang CX;  Sha XC;  Xiao LR;  Ma XL;  Hoeppel HW;  Goeken M;  Wu XL(武晓雷);  Ameyama K;  Han XD;  Zhu YT
Adobe PDF(2171Kb)  |  Favorite  |  View/Download：402/99  |  Submit date：2019/09/09
Heterostructured materials  deformation mechanism  Frank-Read source  in-situ TEM