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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：325/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Nanomechanics of graphene 期刊论文
NATIONAL SCIENCE REVIEW, 2019, 卷号: 6, 期号: 2, 页码: 324-348
Authors:  Wei YJ(魏宇杰);  Yang RG(杨荣贵)
View  |  Adobe PDF(1360Kb)  |  Favorite  |  View/Download：309/78  |  Submit date：2019/12/02
graphene  strength  wrinkling  pentagon-heptagon rings  carbon honeycomb  
Tunable Adhesion of a Bio-Inspired Micropillar Arrayed Surface Actuated by a Magnetic Field 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2019, 卷号: 86, 期号: 1, 页码: 11
Authors:  Li XJ(李兴济);  Peng ZL(彭志龙);  Yang YZ(杨亚政);  Chen SH(陈少华)
View  |  Adobe PDF(3105Kb)  |  Favorite  |  View/Download：490/206  |  Submit date：2019/12/02
micropillar arrayed surface  magnetic field  tunable adhesion  mechanical mechanism  large elastic deformation