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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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Language:英语
Funding Organization:National Natural Science Foundation of China
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Enhanced mechanical performance of gradient-structured CoCrFeMnNi high-entropy alloys induced by industrial shot-blasting
期刊论文
RARE METALS, 2023, 卷号: 42, 期号: 3, 页码: 982-993
Authors:
Zhang, MingZhi
;
Zhang K(张坤)
;
Song, KaiKai
;
Zou, XiaoYu
;
Song, WeiDong
;
Li, KeFeng
;
Hu, LiNa
;
Zhang, ZeQun
;
Eckert, Juergen
Adobe PDF(10570Kb)
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View/Download:279/54
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Submit date:2023/02/03
High-entropy alloy
Shot blasting
Gradient structure
Mechanical property
Deformation mechanism
Laser nitriding of Zr-based metallic glass: An investigation by orthogonal experiments
期刊论文
SURFACE & COATINGS TECHNOLOGY, 2021, 卷号: 424, 页码: 11
Authors:
Hong, Jing
;
Qian, Yongfeng
;
Zhang, Lin
;
Huang, Hu
;
Jiang MQ(蒋敏强)
;
Yan, Jiwang
Adobe PDF(5388Kb)
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View/Download:325/62
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Submit date:2021/11/01
Laser nitriding
Metallic glass
Orthogonal experiment
Surface hardness
Hydrogen induced slowdown of spallation in high entropy alloy under shock loading
期刊论文
INTERNATIONAL JOURNAL OF PLASTICITY, 2021, 卷号: 139, 页码: 19
Authors:
Xie ZC(谢周璨)
;
Li C(李琛)
;
Wang HY(汪海英)
;
Lu CS(卢春生)
;
Dai LH(戴兰宏)
Adobe PDF(9552Kb)
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Submit date:2021/05/06
Hydrogen embrittlement
High entropy alloy
Spallation
Trans-scale model
Statistical damage mechanics
Crystallization behavior and mechanical response of metallic glass induced by ion irradiation at elevated temperature
期刊论文
JOURNAL OF NUCLEAR MATERIALS, 2021, 卷号: 545, 页码: 7
Authors:
Zhang K(张坤)
;
Wang, Yang
;
Zhang, Wanhao
;
Hu, Zheng
;
Wei BC(魏炳忱)
;
Feng, Yihui
Adobe PDF(2319Kb)
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Submit date:2021/03/30
metallic glass
ion irradiation
crystallization
mechanical properties
nanoindentation
Microstructure Observation and Nanoindentation Size Effect Characterization for Micron-/Nano-Grain TBCs
期刊论文
COATINGS, 2020, 卷号: 10, 期号: 4, 页码: 12
Authors:
Liu, HY
;
Wei YG(魏悦广)
;
Liang LH(梁立红)
;
Wang YB(王颖彪)
;
Song JR(宋晶如)
;
Long, H
;
Liu, YW
Adobe PDF(3719Kb)
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Submit date:2020/06/22
micron-
nano-grain coatings
microstructure
nanoindentation size effect
trans-scale mechanics theory
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:
Song M
;
Wei ZQ(魏志全)
;
Wang BY
;
Chen L
;
Chen L
;
Szpunar JA
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View/Download:346/189
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Submit date:2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis