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Bioinspired staggered-array structure design for flexible batteries 期刊论文
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2022, 卷号: 256, 页码: 16
Authors:  Li S(李爽);  Li,Rui;  An,Dongqi;  Wang YK(王勇康);  Xu XK(徐新凯);  Xue,Riye;  Su YW(苏业旺)
Adobe PDF(9459Kb)  |  Favorite  |  View/Download：228/60  |  Submit date：2022/11/14
Flexible battery  Bioinspired structure  Staggered array  Analytic model  Bulk volume  
Contact-Resistance-Free Stretchable Strain Sensors with High Repeatability and Linearity 期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 1, 页码: 541-553
Authors:  Li S(李爽);  Liu GD(刘国栋);  Li, Rui;  Li QL(李沁蓝);  Zhao Y(赵阳);  Huang, Mingqi;  Zhang MY(张懋意);  Yin SZ(尹世珍);  Zhou, Yixin;  Tang, Hao;  Wang, Liwu;  Fang, Guanhui;  Su YW(苏业旺)
Adobe PDF(8626Kb)  |  Favorite  |  View/Download：2312/1993  |  Submit date：2022/02/17
flexible electronics  stretchable strain sensors  high repeatability  high linearity  Tianwen-1  
Ultrastrong low-carbon nanosteel produced by heterostructure and interstitial mediated warm rolling 期刊论文
SCIENCE ADVANCES, 2020, 卷号: 6, 期号: 39, 页码: 7
Authors:  Gao B;  Lai QQ;  Cao Y;  Hu R;  Xiao LR;  Pan ZY;  Liang NN;  Li YS;  Sha G;  Liu MP;  Zhou H;  Wu XL(武晓雷);  Zhu YT
Adobe PDF(4678Kb)  |  Favorite  |  View/Download：378/159  |  Submit date：2020/11/30
A high-strength heterogeneous structural dual-phase steel 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 期号: 19, 页码: 12898-12910
Authors:  Gao B;  Pan ZY;  Li JS;  Ma Y(马彦);  Cao YY;  Liu MP;  Lai QQ;  Xiao LR;  Zhou H
View  |  Adobe PDF(4321Kb)  |  Favorite  |  View/Download：462/116  |  Submit date：2019/09/09
Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
Adobe PDF(3448Kb)  |  Favorite  |  View/Download：326/167  |  Submit date：2020/03/11
Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：324/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
In-situ observation of dislocation dynamics near heterostructured interfaces 期刊论文
MATERIALS RESEARCH LETTERS, 2019, 卷号: 7, 期号: 9, 页码: 376-382
Authors:  Zhou H;  Huang CX;  Sha XC;  Xiao LR;  Ma XL;  Hoeppel HW;  Goeken M;  Wu XL(武晓雷);  Ameyama K;  Han XD;  Zhu YT
View  |  Adobe PDF(2171Kb)  |  Favorite  |  View/Download：386/93  |  Submit date：2019/09/09
Heterostructured materials  deformation mechanism  Frank-Read source  in-situ TEM