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微重力重点实验室 [2]
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Indexed By:SCI
Source Publication:MICROGRAVITY SCIENCE AND TECHNOLOGY
Funding Organization:National Natural Science Foundation of China
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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:
Wang, Shuai
;
Ma, Xiang
;
Gao, Quan
;
Wang, Jinyu
;
Xu, Na
;
Zhang, Yonghai
;
Wei, Jinjia
;
Zhao JF(赵建福)
;
Li, Bin
Adobe PDF(3519Kb)
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Submit date:2023/12/11
Thermal interface material
Thermal conductivity
Copper powder
Diamond particles
Filling rate
Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72
期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2022, 卷号: 34, 期号: 3, 页码: 15
Authors:
Chen, Hongqiang
;
Xu, Pengzhuo
;
Du WF(杜王芳)
;
Zhang, Yonghai
;
Zhu ZQ(朱志强)
;
Wei, Jinjia
Adobe PDF(2750Kb)
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View/Download:181/42
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Submit date:2022/07/18
Pool boiling
Heat transfer enhancement
Mini-pin-fins
Critical heat flux