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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：117/4  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2022, 卷号: 34, 期号: 3, 页码: 15
Authors:  Chen, Hongqiang;  Xu, Pengzhuo;  Du WF(杜王芳);  Zhang, Yonghai;  Zhu ZQ(朱志强);  Wei, Jinjia
Adobe PDF(2750Kb)  |  Favorite  |  View/Download：161/37  |  Submit date：2022/07/18
Pool boiling  Heat transfer enhancement  Mini-pin-fins  Critical heat flux