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Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling 期刊论文
Microgravity Science and Technology, 2009, 卷号: 21, 期号: S1, 页码: S159-S173
Authors:  Wei JJ(魏进家);  Zhao JF(赵建福);  Yuan M;  Xue YF(薛艳芳);  Wei JJ(魏进家)
Adobe PDF(691Kb)  |  Favorite  |  View/Download:1069/303  |  Submit date:2009/12/24