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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：128/6  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Disturbed Flow-Facilitated Margination and Targeting of Nanodisks Protect against Atherosclerosis 期刊论文
SMALL, 2023, 卷号: 19, 期号: 2, 页码: 10.1002/smll.202204694
Authors:  Zhao, ChuanRong;  Li, Jingyi;  Jiang, ZhiTong;  Zhu, JuanJuan;  Zhao, JiaNan;  Yang, QianRu;  Yao, Weijuan;  Pang, Wei;  Li N(李宁);  Yu, Miaorong;  Gan, Yong;  Zhou, Jing
Adobe PDF(4465Kb)  |  Favorite  |  View/Download：255/92  |  Submit date：2022/12/20
atherosclerosis  decitabine  endothelial inflammation  hemodynamics  nanoparticles