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Source Publication：2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Date Issued：2010
Language：英语
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Extracting nanowire mechanical properties from three-point bendig test
会议论文
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, Las Vegas, NV, United states, June 2, 2010 - June 5, 2010
Authors:
Liu Y
;
Zhang Y(张吟)
;
Liu, Y.
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View/Download：135/0
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Submit date：2017/06/20
Changing Trends
Elastic Medium
Experimental Data
Nanowire Materials
Receding Contact
Significant Impacts
Three-point Bending Test
Young's Modulus
