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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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Chen L [1]
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魏志全 [1]
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Source Publication：MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Funding Organization：Natural Science Foundation of Shandong Province of China
Funding Project：Fundamental Research Funds for the Central Universities[18CX05002A]
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Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:
Song M
;
Wei ZQ(魏志全)
;
Wang BY
;
Chen L
;
Chen L
;
Szpunar JA
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Submit date：2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis
