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An in situ system for simultaneous stress measurement and optical observation of silicon thin film electrodes 期刊论文
JOURNAL OF POWER SOURCES, 2019, 卷号: 444, 页码: 5
Authors:  Chen J;  Yang L;  Han Y;  Bao YH;  Zhang KL;  Li X;  Pang J;  Chen HS;  Song WL;  Wei YJ(魏宇杰);  Fang DN
View  |  Adobe PDF(774Kb)  |  Favorite  |  View/Download:462/156  |  Submit date:2020/03/11
Lithium ion batteries  Silicon film  Multi-beam optical sensor (MOS)  in situ stress measurement  Colorimetric method  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download:325/182  |  Submit date:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis