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Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
Authors:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  Favorite  |  View/Download：993/396  |  Submit date：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni  
Combined Effects of Silica Filler and Its Interface in Epoxy Resin 期刊论文
Acta Materialia, 2002, 卷号: 50, 期号: 17, 页码: 4369-4377
Authors:  Wang HY(汪海英);  Bai YL(白以龙);  Liu S(刘胜);  Wu JL;  Wong CP;  Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Adobe PDF(459Kb)  |  Favorite  |  View/Download：1090/404  |  Submit date：2007/06/15
Formation, microstructure and development of the localized shear deformation in low-carbon steels 期刊论文
Acta Materialia, 1996, 卷号: 44, 期号: 5, 页码: 1917-1926
Authors:  Xu YB;  Bai YL(白以龙);  Xue Q;  Shen LT(沈乐天);  Xu, YB (reprint author), CHINESE ACAD SCI,INST MET RES,STATE KEY LAB FATIGUE & FRACTURE MAT,SHENYANG 110015,PEOPLES R CHINA.
Adobe PDF(5914Kb)  |  Favorite  |  View/Download：948/219  |  Submit date：2009/08/03
High-strain Rates  Adiabatic Shear  Band Formation  Instability  Flow