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Microstructural and Interfacial Characterization of Ti-V Diffusion Bonding Zones 期刊论文
METALS, 2022, 卷号: 12, 期号: 12, 页码: 15
Authors:  Liu GL(刘国亮);  Ding ML(丁美丽);  Zhang K(张坤);  Qu DD(屈丹丹);  Meng Y(孟洋);  Luo GX(罗耕星);  Yang SW
Adobe PDF(5946Kb)  |  Favorite  |  View/Download：100/36  |  Submit date：2023/02/03
Ti-V interface  diffusion bonding  interface migration  martensite transformation  recrystallization  
Longitudinal Ultrasonic Vibration Assisted Rapid Solid Phase Bonding of 2024 Aluminum Alloy Using Ag as Interlayer for Structure Lightweight Design 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020
Authors:  Ning BQ;  Nie Y;  Wang Q;  Fu Y;  Li Y;  Han J;  Shao YF(邵颖峰);  Yan JC
Adobe PDF(3236Kb)  |  Favorite  |  View/Download：220/118  |  Submit date：2020/12/28
Ultrasound  IN-SITU TEM  Aluminum alloy  ZN-AL ALLOY  Intermetallic compound  MECHANICAL-PROPERTIES  Solid phase bonding  JOINTS  Microstructure  MICROSTRUCTURE  Mechanical properties  DEFORMATION  FILLER  INTERFACE  DISLOCATION  DIFFUSION  
Fractal Pattern Formation In Anodic Bonding Of Pyrex Glass/Al/Si 期刊论文
International Journal of Nonlinear Sciences and Numerical Simulation, 2008, 页码: 315-322
Authors:  Hu YQ(胡宇群);  Zhao YP(赵亚溥);  Yu TX(余同希);  Zhao, YP (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(678Kb)  |  Favorite  |  View/Download：874/155  |  Submit date：2009/08/03
Fractal Pattern  Dla  Anodic Bonding  Aluminum Interlayer  Mems  Diffusion-limited Aggregation  Ion Drift Processes  Borosilicate Glass  Depletion  Films  Si  
Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
Authors:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  Favorite  |  View/Download：1000/398  |  Submit date：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni