IMECH-IR

Browse/Search Results:  1-3 of 3 Help

Filters        
Selected(0)Clear Items/Page:    Sort:
Strain rate dependent shear localization and deformation mechanisms in the CrMnFeCoNi high-entropy alloy with various microstructures 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 793, 页码: 10
Authors:  Yang ZL(杨正凌);  Yang MX(杨沐鑫);  Ma Y(马彦);  Zhou LL(周玲玲);  Cheng WQ(程文强);  Yuan FP(袁福平);  Wu XL(武晓雷)
Adobe PDF(13197Kb)  |  Favorite  |  View/Download:349/120  |  Submit date:2020/11/30
High entropy alloys  Deformation twins  Shear localization  Strain rate effect  Strain hardening  
Abnormal softening of Ti-metallic glasses during nanosecond laser shock peening 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 773, 页码: 6
Authors:  Li YS(李炎森);  Zhang K(张坤);  Wang Y(王洋);  Tang WQ(唐伟奇);  Zhang YT(张亚婷);  Wei BC(魏炳忱);  Hu Z(胡铮)
View  |  Adobe PDF(1751Kb)  |  Favorite  |  View/Download:438/93  |  Submit date:2020/04/07
Laser shock wave  Metallic glass  Grid nanoindentation  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download:327/183  |  Submit date:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis