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Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, PEOPLES R CHINA, JUN 27-30, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
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Multi-Scale Characterizations for Ductile Thin Film Delamination 会议论文
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, MAY 31-JUN 04, 2004 Hong Kong Univ Sci & Technol, Hong Kong, PEOPLES R CHINA
Authors:  Wei YG(魏悦广);  Xu GS
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Solutions and discussions of thin film undergoing the nonlinear peeling 会议论文
Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting, Boston, MA, DEC 01-05, 2003
Authors:  Wei YG(魏悦广);  Shu SQ;  Du Y;  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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Failure mechanism researches of material surface and interface in micro-scratch test 会议论文
Conference on Surface Engineering 2002 - Synthesis, Characterization and Applications held at the 2002 MRS Fall Meeting, BOSTON, MA, DEC 02-05, 2002
Authors:  Wei YG(魏悦广);  Zhao MH;  Tang S;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
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Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates 会议论文
SURFACE ENGINEERING 2001 - FUNDAMENTALS AND APPLICATIONS, 2001
Authors:  Wei YG(魏悦广)
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