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Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, PEOPLES R CHINA, JUN 27-30, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
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Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
View  |  Adobe PDF(165Kb)  |  Favorite  |  View/Download：116/25  |  Submit date：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination  
Solutions and discussions of thin film undergoing the nonlinear peeling 会议论文
Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting, Boston, MA, DEC 01-05, 2003
Authors:  Wei YG(魏悦广);  Shu SQ;  Du Y;  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
View  |  Adobe PDF(205Kb)  |  Favorite  |  View/Download：180/67  |  Submit date：2016/06/30