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A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61, 期号: 6, 页码: 64611
Authors:  Yi DK(易大可);  Wang TC(王自强)
View  |  Adobe PDF(1561Kb)  |  Favorite  |  View/Download：447/146  |  Submit date：2018/10/30
three-dimensional fracture analysis  out-of-plane constraint  three-dimensional J-integral  
In-Plane Heterostructures Enable Internal Stress Assisted Strain Engineering in 2D Materials 期刊论文
SMALL, 2018, 卷号: 14, 期号: 15, 页码: 1703512
Authors:  Liu F(刘峰);  Wang TC(王自强);  Tang QH(汤奇恒)
View  |  Adobe PDF(3092Kb)  |  Favorite  |  View/Download：303/147  |  Submit date：2018/10/30
2D materials  Eshelby inclusion theory  in-plane heterostructures  MD simulations  strain engineering