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| Efficient strategy for reliability-based optimization design of multidisciplinary coupled system with interval parameters 期刊论文 APPLIED MATHEMATICAL MODELLING, 2019, 卷号: 75, 页码: 349-370 Authors: Wang RX(王睿星); Luo Y Adobe PDF(4483Kb)  |  Favorite  |  View/Download:242/86  |  Submit date:2019/11/25 Multidisciplinary design optimization Non-probabilistic reliability Uncertainty propagation analysis Gradient information Interval reliability displacement |
| A high-strength heterogeneous structural dual-phase steel 期刊论文 JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 期号: 19, 页码: 12898-12910 Authors: Gao B; Pan ZY; Li JS; Ma Y(马彦); Cao YY; Liu MP; Lai QQ; Xiao LR; Zhou H Adobe PDF(4321Kb)  |  Favorite  |  View/Download:462/116  |  Submit date:2019/09/09 |
| Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文 INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9 Authors: Long X; Hu B; Feng YH(冯义辉); Chang C; Li MY Adobe PDF(3448Kb)  |  Favorite  |  View/Download:326/167  |  Submit date:2020/03/11 Silver nanoparticles Silver microparticles Nanoindentation Microstructure Constitutive behaviour |
| New analytic buckling solutions of rectangular thin plates with two free adjacent edges by the symplectic superposition method 期刊论文 EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2019, 卷号: 76, 页码: 247-262 Authors: Li R(李睿); Wang HY; Zheng XR; Xiong SJ; Hu ZY; Yan XY; Xiao Z; Xu HL; Li P Adobe PDF(3849Kb)  |  Favorite  |  View/Download:300/132  |  Submit date:2019/09/09 Analytic solution Plate buckling Free edge Free comer Symplectic superposition method |
| Carbon fiber reinforced shape memory epoxy composites with superior mechanical performances 期刊论文 COMPOSITES SCIENCE AND TECHNOLOGY, 2019, 卷号: 177, 页码: 49-56 Authors: Liu YY; Guo YF; Zhao J; Chen XD(陈晓东); Zhang H; Hu GQ(胡国庆); Yu X; Zhang Z Adobe PDF(2945Kb)  |  Favorite  |  View/Download:314/192  |  Submit date:2019/12/02 Shape memory epoxy Carbon fiber Composites High stiffness |
| Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74 Authors: Song M; Wei ZQ(魏志全); Wang BY; Chen L; Chen L; Szpunar JA Adobe PDF(5717Kb)  |  Favorite  |  View/Download:324/182  |  Submit date:2019/11/27 Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis |
| Effect of Micro-Steps on Twinning and Interfacial Segregation in Mg-Ag Alloy 期刊论文 MATERIALS, 2019, 卷号: 12, 期号: 8, 页码: 7 Authors: Liu Y; Chen XF(陈雪飞); Wei K; Xiao LR; Chen B; Long HB; Yu YD; Hu ZH; Zhou H Adobe PDF(2228Kb)  |  Favorite  |  View/Download:370/108  |  Submit date:2019/06/28 magnesium alloy twinning HAADF-STEM interfacial structure |
| In-situ observation of dislocation dynamics near heterostructured interfaces 期刊论文 MATERIALS RESEARCH LETTERS, 2019, 卷号: 7, 期号: 9, 页码: 376-382 Authors: Zhou H; Huang CX; Sha XC; Xiao LR; Ma XL; Hoeppel HW; Goeken M; Wu XL(武晓雷); Ameyama K; Han XD; Zhu YT Adobe PDF(2171Kb)  |  Favorite  |  View/Download:386/93  |  Submit date:2019/09/09 Heterostructured materials deformation mechanism Frank-Read source in-situ TEM |