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Indexed By：SCI
Source Publication：MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Date Issued：2019
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Superior mechanical properties and deformation mechanisms of heterogeneous laminates under dynamic shear loading
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 756, 页码: 492-501
Authors:
He JY(何金燕)
;
Yuan FP(袁福平)
;
Yang MX(杨沐鑫)
;
Jiao SH(焦四海)
;
Wu XL(武晓雷)
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Adobe PDF(1558Kb)
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View/Download：411/93
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Submit date：2019/09/09
Laminates
Twinning
Strain gradient
Geometrically necessary dislocations
Dynamic fracture
Shear band
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:
Song M
;
Wei ZQ(魏志全)
;
Wang BY
;
Chen L
;
Chen L
;
Szpunar JA
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Adobe PDF(5717Kb)
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View/Download：331/185
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Submit date：2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis
