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| Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
Authors: Wang Q; NieY; Shao YF(邵颖峰) ; LiuHZ; HuXQ; LiDZ
 Adobe PDF(18909Kb) |  Favorite | View/Download：259/38 | Submit date：2022/03/28
Ultrasound Solid phase welding Plastic deformation Amorphous Intermetallic compound |
| Assessment of thermo-mechanical fatigue in a nickel-based single-crystal superalloy CMSX-4 accounting for temperature gradient effects 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 809, 页码: 17
Authors: Sun JY(孙靖宇); Yang Shun; Yuan Huang
Adobe PDF(15366Kb) | Favorite | View/Download：344/68 | Submit date：2021/05/06
Thermal gradient mechanical fatigue (TGMF) Temperat u r e gradient Thermal-mechanical phase angle Single crystal superalloy Fatigue life model |
| Abnormal softening of Ti-metallic glasses during nanosecond laser shock peening 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 773, 页码: 6
Authors: Li YS(李炎森); Zhang K(张坤); Wang Y(王洋); Tang WQ(唐伟奇); Zhang YT(张亚婷); Wei BC(魏炳忱); Hu Z(胡铮)
 View | Adobe PDF(1751Kb) | Favorite | View/Download：439/94 | Submit date：2020/04/07
Laser shock wave Metallic glass Grid nanoindentation |
| Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors: Song M; Wei ZQ(魏志全); Wang BY; Chen L; Chen L; Szpunar JA
View | Adobe PDF(5717Kb) | Favorite | View/Download：332/185 | Submit date：2019/11/27
Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis |
