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Optimizing physical aging in poly(ethylene terephthalate)-glycol (PETG) 期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2018, 卷号: 502, 页码: 15-21
Authors:  Guo J;  Xiao R;  Tian CS;  Jiang MQ(蒋敏强)
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Physical aging  Structural relaxation  PETG  
基于力-化-电耦合理论的电极结构有限元模拟及结构优化 学位论文
博士论文,北京: 中国科学院大学, 2018
Authors:  温济慈
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锂离子电池  高能量密度电极材料  力-化-电耦合理论  有限单元法  结构优化设计  
An inverse problem in film/substrate indentation: extracting both the Young's modulus and thickness of films 期刊论文
ACTA MECHANICA SINICA, 2018, 卷号: 34, 期号: 6, 页码: 1061-1071
Authors:  Zhang Y(张吟);  Gao FF(高斐斐);  Zheng ZY;  Cheng ZH
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Indentation test  Film  Substrate  Inverse problem  
Atomistic simulation study on the shear behavior of Ag/MgO interface 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 155, 页码: 116-128
Authors:  Fu X Q;  Liang LH(梁立红);  Wei YG(魏悦广)
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Metal/oxide interface  Interface stress  Interface shear displacement  Misfit dislocation  Atomistic simulation  
Microstructure, mechanical properties, and cutting performance of TiAlSiN multilayer coatings prepared by HiPIMS 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 353, 页码: 274-281
Authors:  Li GD;  Sun JF;  Xu Y;  Xu Y(许亿);  Gu JB;  Wang L;  Huang K;  Liu K;  Li LH
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Tialsin  Hipims  Inconel 718  Film Toughness  Cutting Tools  
Microstructure, mechanical properties, and cutting performance of TiAlSiN multilayer coatings prepared by HiPIMS 期刊论文
Surface and coatings technology, 2018, 卷号: 353, 页码: 274-281
Authors:  Li GD;  Sun JF;  Xu Y;  Xu Y(许亿);  Gu JB;  Wang L;  Huang K;  Liu K;  Li LL
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Inclusion problem in second gradient elasticity 期刊论文
INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 2018, 卷号: 132, 页码: 60-78
Authors:  Ma HS(马寒松);  Hu GK;  Wei YG(魏悦广);  Liang LH(梁立红)
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Green's function  Eshelby tensor  Second gradient  Inclusion  Effective modulus  
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608
Authors:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉);  Chang C
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nanoindentation  constitutive model  rate factor  dimensionless analysis  solder  
Study on failure mechanism of Cu-polyethylene-Cu sandwich structure by molecular dynamics simulation 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 154, 页码: 315-324
Authors:  Meng CY(孟昶宇);  Liao LJ(廖丽涓);  Huang CG(黄晨光)
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Failure Mechanism  Sandwich Structure  Molecular Dynamics  Thickness-dependence  Micro-void Nucleation  Dihedral Distribution  
On similarity criteria of thin-walled cylinder subjected to complex thermomechanical loads 期刊论文
THIN-WALLED STRUCTURES, 2018, 卷号: 132, 期号: SI, 页码: 549-557
Authors:  Ma T(马特);  Xing XD;  Song HW(宋宏伟);  Huang CG(黄晨光)
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Similarity criteria  Thin-walled cylinder  Thermomechanical loads  Thermal elastoplastic  Buckling  Dynamic rupture