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Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
作者:  Wang Q;  NieY;  Shao YF(邵颖峰);  LiuHZ;  HuXQ;  LiDZ
Adobe PDF(18909Kb)  |  收藏  |  浏览/下载：229/29  |  提交时间：2022/03/28
Ultrasound  Solid phase welding  Plastic deformation  Amorphous  Intermetallic compound  
Extraordinary fracture toughness in nickel induced by heterogeneous grain structure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 830, 页码: 11
作者:  Zhang SD(张胜德);  Yang MX(杨沐鑫);  Yuan FP(袁福平);  Zhou LL(周玲玲);  Wu XL(武晓雷)
Adobe PDF(23163Kb)  |  收藏  |  浏览/下载：232/20  |  提交时间：2022/01/13
Heterogeneous grain structures  Fracture toughness  Ductility  Strain hardening  J-R curves  
Superior mechanical properties and deformation mechanisms of heterogeneous laminates under dynamic shear loading 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 756, 页码: 492-501
作者:  He JY(何金燕);  Yuan FP(袁福平);  Yang MX(杨沐鑫);  Jiao SH(焦四海);  Wu XL(武晓雷)
浏览  |  Adobe PDF(1558Kb)  |  收藏  |  浏览/下载：372/88  |  提交时间：2019/09/09
Laminates  Twinning  Strain gradient  Geometrically necessary dislocations  Dynamic fracture  Shear band  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：311/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis