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Strain distribution and lattice rotations during in-situ tension of aluminum with a transmodal grain structure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 828, 页码: 11
作者:  Gao, W. Q.;  Zhang, C. L.;  杨沐鑫.;  Zhang, S. Q.;  Jensen, D. Juul;  Godfrey, A.
Adobe PDF(8128Kb)  |  收藏  |  浏览/下载：253/71  |  提交时间：2021/11/01
Heterogenous grain structure  Strain distribution  High-resolution digital image correlation (HR-DIC)  Near-micrometer grain size  Electron backscatter diffraction (EBSD)  
Strain rate dependent shear localization and deformation mechanisms in the CrMnFeCoNi high-entropy alloy with various microstructures 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 793, 页码: 10
作者:  Yang ZL(杨正凌);  Yang MX(杨沐鑫);  Ma Y(马彦);  Zhou LL(周玲玲);  Cheng WQ(程文强);  Yuan FP(袁福平);  Wu XL(武晓雷)
Adobe PDF(13197Kb)  |  收藏  |  浏览/下载：327/114  |  提交时间：2020/11/30
High entropy alloys  Deformation twins  Shear localization  Strain rate effect  Strain hardening  
Superior mechanical properties and deformation mechanisms of heterogeneous laminates under dynamic shear loading 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 756, 页码: 492-501
作者:  He JY(何金燕);  Yuan FP(袁福平);  Yang MX(杨沐鑫);  Jiao SH(焦四海);  Wu XL(武晓雷)
浏览  |  Adobe PDF(1558Kb)  |  收藏  |  浏览/下载：372/88  |  提交时间：2019/09/09
Laminates  Twinning  Strain gradient  Geometrically necessary dislocations  Dynamic fracture  Shear band  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：311/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis