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Critical compressive strain and interfacial damage evolution of EB-PVD thermal barrier coating 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 776, 页码: 9
作者:  Jing FL;  Yang JJ;  Yang ZM(杨正茂);  Zeng W
浏览  |  Adobe PDF(1425Kb)  |  收藏  |  浏览/下载：322/117  |  提交时间：2020/04/07
Thermal barrier coating  Critical compressive strain  Interfacial damage evolution  Isothermal and cyclic oxidation  Life prediction  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：312/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Effects of different heat treatments on the dynamic shear response and shear localization in Inconel 718 alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 725, 页码: 76-87
作者:  Song WD;  Hu ML;  Zhang HS(张虎生);  Jin YX
Adobe PDF(7311Kb)  |  收藏  |  浏览/下载：278/107  |  提交时间：2018/07/17
Inconel 718  Dynamic Response  Adiabatic Shear Band  Microstructure