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Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, PEOPLES R CHINA, JUN 27-30, 2005
作者:  Wei YG(魏悦广);  Zhao HF;  Shu SQ;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
浏览  |  Adobe PDF(247Kb)  |  收藏  |  浏览/下载：172/93  |  提交时间：2016/06/28
Solutions and discussions of thin film undergoing the nonlinear peeling 会议论文
Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting, Boston, MA, DEC 01-05, 2003
作者:  Wei YG(魏悦广);  Shu SQ;  Du Y;  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
浏览  |  Adobe PDF(205Kb)  |  收藏  |  浏览/下载：164/62  |  提交时间：2016/06/30
Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates 会议论文
SURFACE ENGINEERING 2001 - FUNDAMENTALS AND APPLICATIONS, 2001
作者:  Wei YG(魏悦广)
浏览  |  Adobe PDF(139Kb)  |  收藏  |  浏览/下载：508/118  |  提交时间：2007/06/15