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Assessment of thermo-mechanical fatigue in a nickel-based single-crystal superalloy CMSX-4 accounting for temperature gradient effects 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 809, 页码: 17
作者:  Sun JY(孙靖宇);  Yang Shun;  Yuan Huang
Adobe PDF(15366Kb)  |  收藏  |  浏览/下载：327/66  |  提交时间：2021/05/06
Thermal gradient mechanical fatigue (TGMF)  Temperat u r e gradient  Thermal-mechanical phase angle  Single crystal superalloy  Fatigue life model  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：322/182  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis