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Effects of thermal aging on the cyclic thermal shock behavior of oxide/oxide ceramic matrix composites 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 769, 页码: 8
作者:  Yang ZM(杨正茂);  Liu H
Adobe PDF(1764Kb)  |  收藏  |  浏览/下载：305/120  |  提交时间：2020/03/11
Ceramic matrix composites  Cyclic thermal shocks  Thermal aging  Hierarchical porosity  Strain energy release rate  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：312/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis