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Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
作者:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  收藏  |  浏览/下载：980/395  |  提交时间：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni  
Molecular Dynamics And Density Functional Studies Of A Body-Centered-Tetragonal Polymorph Of Zno 期刊论文
Physical Review B, 2007
作者:  Wang J;  Kulkarni AJ;  Sarasamak K;  Limpijumnong S;  Ke FJ(柯孚久);  Zhou M;  Zhou, M (reprint author), Beihang Univ, Dept Phys, Beijing 100083, Peoples R China.
Adobe PDF(586Kb)  |  收藏  |  浏览/下载：812/232  |  提交时间：2009/08/03
Semiconducting Oxide Nanobelts