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Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2018, 卷号: 85, 期号: 9, 页码: Ar-91004
作者:  Yin HB;  Chen SH;  Liang LH(梁立红);  Peng ZL(彭志龙);  Wei YG(魏悦广)
浏览  |  Adobe PDF(4041Kb)  |  收藏  |  浏览/下载：348/138  |  提交时间：2018/12/12
film-substrate system  interface behavior  peeling force  cohesive zone model  L-J potential  
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations 期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
作者:  You XM(尤雪梅);  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(345Kb)  |  收藏  |  浏览/下载：653/138  |  提交时间：2009/08/03
Peel Test  Interface Toughness  Cohesive Zone Model  Energy Release Rate  Ductile Thin-films  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Ceramic Substrate  Metal-film  Strength  Layer  Plasticity  Surface  
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
作者:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
浏览  |  Adobe PDF(165Kb)  |  收藏  |  浏览/下载：105/22  |  提交时间：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination