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One-step annealing optimizes strength-ductility tradeoff in pearlitic steel wires 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 757, 页码: 1-13
作者:  Xiang L(向亮);  Liang LW(梁伦伟);  Wang YJ(王云江);  Chen Y(陈艳);  Wang HY(汪海英);  Dai LH(戴兰宏)
Adobe PDF(3415Kb)  |  收藏  |  浏览/下载：459/156  |  提交时间：2019/09/09
Pearlitic steel wire  Carbon state  Annealing  Strength and ductility  Atomistic simulations  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：311/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
浏览  |  Adobe PDF(991Kb)  |  收藏  |  浏览/下载：318/154  |  提交时间：2017/10/27
Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour