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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：311/179  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Effect of thermal annealing on the structural, electrical and optical properties of Al-Ni co-doped ZnO thin films prepared using a sol-gel method 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2015, 卷号: 261, 页码: 149-155
作者:  Zhang XL;  Hui KS;  Bin F(宾峰);  Hui KN;  Li L;  Cho YR;  Mane RS;  Zhou W;  Hui, KS (reprint author), Hanyang Univ, Dept Mech Convergence Engn, 17 Haengdang Dong, Seoul 133791, South Korea.
浏览  |  Adobe PDF(955Kb)  |  收藏  |  浏览/下载：431/124  |  提交时间：2015/03/17
Al-ni Co-doped Zno  Annealing Temperature  Sol-gel Method  Forming Gas