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Title:
Measurement of Young’s modulus and residual stress of copper film electroplated on silicon wafer
Author: Zhou Y; Yang CS; Chen JA; Ding GF,; Ding W; Wang L; Wang MJ; Zhang YM; Zhang TH(张泰华)
Source: Thin Solid Films
Issued Date: 2004
Volume: 460, Issue:1, Pages:175-180
Language: 英语
Indexed Type: SCI
DOI: 10.1016/j.tsf.2004.01.088
DOC Type: Article
WOS Subject: Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
WOS Subject Extended: Materials Science ; Physics
WOS ID: WOS:000222217500025
ISSN: 0040-6090
Subject: 力学
Citation statistics:
Content Type: 期刊论文
URI: http://dspace.imech.ac.cn/handle/311007/15573
Appears in Collections:力学所知识产出(1956-2008)_期刊论文

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Recommended Citation:
Zhou Y,Yang CS,Chen JA,et al. Measurement of Young’s modulus and residual stress of copper film electroplated on silicon wafer[J]. Thin Solid Films,2004-01-01,460(1):175-180.
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