Thermal-mechanical interface crack behaviour of a surface mount solder joint

doi:10.1016/S0168-874X(98)00028-6

IMECH-IR > 力学所知识产出(1956-2008)

	Thermal-mechanical interface crack behaviour of a surface mount solder joint
	Wu CML; Lai JKL; Wu YL(吴永礼); Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China.
发表期刊	Finite Elements in Analysis and Design
	1998
卷号	30 期号:1-2 页码:19-30
ISSN	0168-874X
摘要	The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder.
学科领域	力学
DOI	10.1016/S0168-874X(98)00028-6
收录类别	SCI
语种	英语
WOS记录号	WOS:000075181400003
关键词[WOS]	BONDED JOINTS
WOS研究方向	Mathematics ; Mechanics
WOS类目	Mathematics, Applied ; Mechanics
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/16074
专题	力学所知识产出(1956-2008)
通讯作者	Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China.
推荐引用方式 GB/T 7714	Wu CML,Lai JKL,Wu YL,et al. Thermal-mechanical interface crack behaviour of a surface mount solder joint[J]. Finite Elements in Analysis and Design,1998,30,1-2,:19-30.
APA	Wu CML,Lai JKL,吴永礼,&Wu, CML .(1998).Thermal-mechanical interface crack behaviour of a surface mount solder joint.Finite Elements in Analysis and Design,30(1-2),19-30.
MLA	Wu CML,et al."Thermal-mechanical interface crack behaviour of a surface mount solder joint".Finite Elements in Analysis and Design 30.1-2(1998):19-30.

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