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Title:
Thermal-mechanical interface crack behaviour of a surface mount solder joint
Author: Wu CML; Lai JKL; Wu YL(吴永礼)
Source: Finite Elements in Analysis and Design
Issued Date: 1998
Volume: 30, Issue:1-2, Pages:19-30
Abstract: The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder.
Language: 英语
Indexed Type: SCI
Corresponding Author: Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China.
DOI: 10.1016/S0168-874X(98)00028-6
DOC Type: Article
WOS Subject: Mathematics, Applied ; Mechanics
WOS Subject Extended: Mathematics ; Mechanics
WOS Keyword Plus: BONDED JOINTS
WOS ID: WOS:000075181400003
ISSN: 0168-874X
Subject: 力学
Citation statistics:
Content Type: 期刊论文
URI: http://dspace.imech.ac.cn/handle/311007/16074
Appears in Collections:力学所知识产出(1956-2008)_期刊论文

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Recommended Citation:
Wu CML,Lai JKL,Wu YL. Thermal-mechanical interface crack behaviour of a surface mount solder joint[J]. Finite Elements in Analysis and Design,1998-01-01,30(1-2):19-30.
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