Knowledge Management System of Institue of Mechanics, CAS
Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film | |
Hu YQ(胡宇群); Zhao YP(赵亚溥); Yu TX(余同希); Zhao YP | |
Source Publication | Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing |
2008 | |
Pages | 611-616 |
Conference Name | 14th International Conference on the Strength of Materials (ICSMA 14) |
Conference Date | JUN 04-09, 2006 |
Conference Place | Xian Jiaotong Univ, Xian, PEOPLES R CHINA |
Abstract | Anodic bonding with thin films of metal or alloy as an intermediate layer, finds increasing applications in micro/nanoelectromechanical systems. At the bonding temperature of 350 degrees C, voltage of 400 V, and 30 min duration, the anodic bonding is completed between Pyrex glass and crystalline silicon coated with an aluminum thin film with a thickness comprised between 50 and 230 nm. Sodium-depleted layers and dendritic nanostructures were observed in Pyrex 7740 glass adjacent to the bonding interface. The sodium depletion width does not increase remarkably with the thickness of aluminum film. The dendritic nanostructures result from aluminum diffusion into the Pyrex glass. This experimental research is expected to enhance the understanding of how the depletion layer and dendritic nanostructures affect the quality of anodic bonding. (C) 2007 Elsevier B.V. All rights reserved. |
Keyword | Anodic Bonding Dendritic Nanostructures Aluminum Thin Film Depletion Layer Mems Ion Drift Processes Borosilicate Glass Depletion |
WOS ID | WOS:000256071100154 |
Indexed By | CPCI-S |
Language | 英语 |
Citation statistics | |
Document Type | 会议论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/25436 |
Collection | 力学所知识产出(1956-2008) |
Corresponding Author | Zhao YP |
Recommended Citation GB/T 7714 | Hu YQ,Zhao YP,Yu TX,et al. Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film[C]Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing,2008:611-616. |
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