IMECH-IR  > 力学所知识产出(1956-2008)
Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film
Hu YQ(胡宇群); Zhao YP(赵亚溥); Yu TX(余同希); Zhao YP
Source PublicationMaterials Science And Engineering A-Structural Materials Properties Microstructure And Processing
2008
Pages611-616
Conference Name14th International Conference on the Strength of Materials (ICSMA 14)
Conference DateJUN 04-09, 2006
Conference PlaceXian Jiaotong Univ, Xian, PEOPLES R CHINA
AbstractAnodic bonding with thin films of metal or alloy as an intermediate layer, finds increasing applications in micro/nanoelectromechanical systems. At the bonding temperature of 350 degrees C, voltage of 400 V, and 30 min duration, the anodic bonding is completed between Pyrex glass and crystalline silicon coated with an aluminum thin film with a thickness comprised between 50 and 230 nm. Sodium-depleted layers and dendritic nanostructures were observed in Pyrex 7740 glass adjacent to the bonding interface. The sodium depletion width does not increase remarkably with the thickness of aluminum film. The dendritic nanostructures result from aluminum diffusion into the Pyrex glass. This experimental research is expected to enhance the understanding of how the depletion layer and dendritic nanostructures affect the quality of anodic bonding. (C) 2007 Elsevier B.V. All rights reserved.
KeywordAnodic Bonding Dendritic Nanostructures Aluminum Thin Film Depletion Layer Mems Ion Drift Processes Borosilicate Glass Depletion
WOS IDWOS:000256071100154
Indexed ByCPCI-S
Language英语
Citation statistics
Cited Times:15[WOS]   [WOS Record]     [Related Records in WOS]
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/25436
Collection力学所知识产出(1956-2008)
Corresponding AuthorZhao YP
Recommended Citation
GB/T 7714
Hu YQ,Zhao YP,Yu TX,et al. Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film[C]Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing,2008:611-616.
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