IMECH-IR  > 力学所知识产出(1956-2008)
MEMS材料力学性能的测试技术
Alternative TitleMeasurement of mechanical properties of MEMS materials
张泰华; 杨业敏; 赵亚溥; 白以龙
Source Publication力学进展
2002-11-25
Volume32Issue:4Pages:545-562
Abstract微电子机械系统(MEMS)技术的迅速崛起,推动了所用材料微尺度力学性能测试技术的发展,首先按作用方式将实验分成压痕/划痕、弯曲、拉伸、扭转四大类,系统介绍检测MEMS材料微尺度力学性能的微型试样、测试方法及其实验结果。测试材料主要有硅、氧化硅、氮化硅和一些金属。实验结果主要包括基本的力学性能参数如弹性模量、残余应力、屈服强度、断裂强度和疲劳强度等。最后,简要分析了未来的发展需求。
Keyword微电子机械系统 力学性能 纳米压痕/划痕 弯曲 拉伸 扭转
Indexed ByCSCD
Language中文
CSCD IDCSCD:1013611
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/40062
Collection力学所知识产出(1956-2008)
Corresponding Author张泰华
Recommended Citation
GB/T 7714
张泰华,杨业敏,赵亚溥,等. MEMS材料力学性能的测试技术[J]. 力学进展,2002,32(4):545-562.
APA 张泰华,杨业敏,赵亚溥,&白以龙.(2002).MEMS材料力学性能的测试技术.力学进展,32(4),545-562.
MLA 张泰华,et al."MEMS材料力学性能的测试技术".力学进展 32.4(2002):545-562.
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