IMECH-IR  > 力学所知识产出(1956-2008)
Solutions and discussions of thin film undergoing the nonlinear peeling
Wei YG(魏悦广); Shu SQ; Du Y; Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Source PublicationTHIN FILMS-STRESSES AND MECHANICAL PROPERTIES X
2004
Conference NameSymposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting
Conference DateDEC 01-05, 2003
Conference PlaceBoston, MA
AbstractBased on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.
WOS IDWOS:000189484000021
ISBN1-55899-733-4
Indexed ByCPCI-S ; EI
Language英语
Citation statistics
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/58922
Collection力学所知识产出(1956-2008)
Corresponding AuthorWei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Recommended Citation
GB/T 7714
Wei YG,Shu SQ,Du Y,et al. Solutions and discussions of thin film undergoing the nonlinear peeling[C]THIN FILMS-STRESSES AND MECHANICAL PROPERTIES X,2004.
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