Solutions and discussions of thin film undergoing the nonlinear peeling

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	Solutions and discussions of thin film undergoing the nonlinear peeling
	Wei YG(魏悦广); Shu SQ; Du Y; Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
会议录名称	THIN FILMS-STRESSES AND MECHANICAL PROPERTIES X
	2004
会议名称	Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting
会议日期	DEC 01-05, 2003
会议地点	Boston, MA
摘要	Based on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.
WOS记录号	WOS:000189484000021
ISBN号	1-55899-733-4
收录类别	CPCI-S ; EI
语种	英语
引用统计
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/58922
专题	力学所知识产出(1956-2008)
通讯作者	Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
推荐引用方式 GB/T 7714	Wei YG,Shu SQ,Du Y,et al. Solutions and discussions of thin film undergoing the nonlinear peeling[C]THIN FILMS-STRESSES AND MECHANICAL PROPERTIES X,2004.

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