Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

IMECH-IR > 力学所知识产出(1956-2008)

	Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
	Dai LH(戴兰宏); Lee SWR
会议录名称	Advances in Electronic Packaging
	2001
会议名称	Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
会议日期	July 8, 2001 - July 13, 2001
会议地点	Kauai, Hi, United states
摘要	A novel punch shear testing method is introduced in this study to investigate the strain rate-dependent shear behavior of solder materials. Both static and dynamic shear strengths of 63 Sn-37Pb solder were characterized. The experimental results indicate that the shear response of solder alloy is very sensitive to the strain rate and the dynamic shear strength is much higher than the static one. Besides, the localized crack band was found in the dynamic punch shear tests. This phenomenon reveals that the adiabatic shear localization should be a significant mechanism for controlling the mechanical behavior of 63Sn-37Pb solder alloy under dynamic shear loading.
关键词	Adiabatic Shear Localization (Asl)
ISBN号	0791835405
收录类别	EI
语种	英语
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/60252
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Dai LH,Lee SWR. Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy[C]Advances in Electronic Packaging,2001.