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Extracting nanowire mechanical properties from three-point bendig test
Liu Y; Zhang Y(张吟); Liu, Y.
Source Publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
2010
Conference Name2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Conference DateJune 2, 2010 - June 5, 2010
Conference PlaceLas Vegas, NV, United states
AbstractA new adhesive receding contact model is presented in this paper for the nanowire in three-point bending test. Because of its flexurality, the nanowire in test may lift-off/separate from its supporting elastic medium, which can dramatically change the nanowire boundary conditions and deformations. The changes of the nanowire boundary conditions and deformations have the significant impact on the interpretation of the experimental data on the nanowire material properties. Through the model developed here, some explanations are offered to the different even contradicting observations on the nanowire material properties and the nanowire boundary conditions changing trends found in recent experiments. ©2010 IEEE.
KeywordChanging Trends Elastic Medium Experimental Data Nanowire Materials Receding Contact Significant Impacts Three-point Bending Test Young's Modulus
WOS IDWOS:000287517900143
DepartmentLNM纳/微系统力学与物理力学
ISBN9781424453429
URL查看原文
Indexed ByCPCI-S ; EI
Language英语
Citation statistics
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/60347
Collection非线性力学国家重点实验室
Corresponding AuthorLiu, Y.
Recommended Citation
GB/T 7714
Liu Y,Zhang Y,Liu, Y.. Extracting nanowire mechanical properties from three-point bendig test[C],2010.
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