IMECH-IR  > 流固耦合系统力学重点实验室
MOLECULAR DYNAMICS SIMULATIONS ON THE TENSILE DEFORMATION AND FAILURE OF A POLYETHYLENE/COPPER INTERFACE
Liao LJ(廖丽涓); Meng CY(孟昶宇); Huang CG(黄晨光)
Source PublicationPROCEEDINGS OF THE ASME INTERNATIONAL DESIGN ENGINEERING TECHNICAL CONFERENCES AND COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE, 2018, VOL 4
2018
PagesV004T08A017
Conference NameASME International Design Engineering Technical Conferences (IDETC) / Computers and Information in Engineering Conference (CIE)
Conference DateAUG 26-29, 2018
Conference PlaceQuebec City, CANADA
Abstract

In this study, a microscale interface consisting of amorphous polyethylene (PE) chains with the united-atom (UA) model and face-centered cubic (FCC) crystal copper as the substrate was established. Moving the copper layer with a given rate, the damage evolution of the interface during the tensile deformation was examined by molecular dynamics (MD) simulations. The stress-strain relationship was obtained to capture the evolution of tensile deformation. The distribution of the temperature field was adopted to predict the damage initiation and the failure mode. The phase diagram of the failure mode with respect to the thickness of the PE layer and the loading rate was provided. The results show that the PE layer with smaller thickness brings higher load-bearing capacity with larger yield strength. As for the rate-dependence, a rate hardening followed by a rate-softening of yield strength was observed. In addition, the failure modes evolves from cohesive failure to interfacial one as the loading rate of tension increases progressively. It can be assumed that the control parameter on the failure mode changes from pure material strength of PE to the bonding strength between PE and copper. Furthermore, a larger thickness of PE layer leads to the cohesive failure with higher probability under a narrow range of loading rate with small values. However, the thickness-dependence of failure mode attenuates gradually and diminishes ultimately under higher loading rate, which leads to the transformation from mixed mode to interfacial one.

WOS IDWOS:000461131000057
Funding OrganizationNational Natural Science Foundation of China [11672314]
ISBN978-0-7918-5179-1
Indexed ByEI ; CPCI-S
Language英语
Citation statistics
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/78561
Collection流固耦合系统力学重点实验室
Affiliation1.{Liao, Lijuan、Meng, Changyu、Huang, Chenguang} Chinese Acad Sci, Inst Mech, Key Lab Mech Fluid Solid Coupling Syst, Beijing 100190, Peoples R China
2.{Meng, Changyu、Huang, Chenguang} Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
Recommended Citation
GB/T 7714
Liao LJ,Meng CY,Huang CG. MOLECULAR DYNAMICS SIMULATIONS ON THE TENSILE DEFORMATION AND FAILURE OF A POLYETHYLENE/COPPER INTERFACE[C],2018:V004T08A017.
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