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A traction-free model for the tensile stiffness and bending stiffness of laminated ribbons of flexible electronics
Yin SZ(尹世珍)1,2; Su YW(苏业旺)1,2,3
Source PublicationJournal of Applied Mechanics
2019-05
Volume86Issue:5Pages:051011
Abstract

Laminated ribbons have been widely adopted for structures of flexible electronics to simultaneously achieve the electronic functions and mechanical performances. Their effective tensile stiffness and bending stiffness, which are extensively used as fundamental parameters
in the mechanical analysis, are usually obtained by the plane-strain hypothesis for simplicity. However, it is found that the practical condition is usually closer to the traction free, even for the cases with a relatively large width. Here, a traction-free model is proposed to analytically obtain the effective tensile stiffness and bending stiffness of laminated ribbons,
which can be used directly in the mechanical analysis of flexible electronics. The prediction of the traction-free model agrees very well with the precise result obtained by 3D finite element analysis (FEA) for the cases that are in the range of structure designs of flexible electronics. It is found that the tensile/bending stiffness of traction-free model is between the plane-stress model and plane-strain model, but is closer to the plane-stress model. The use of the plane-strain model sometimes may yield a considerable error in the mechanical analysis of flexible electronics. The parameter study shows that this model is very important for the problems with advanced materials, such as metamaterials with negative Poisson’s ratio. This work provides a theoretical basis for the mechanical analysis of flexible electronics.

KeywordLaminated Ribbon, Tensile Stiffness, Bending Stiffness, Plane-strain, Plane-stress, Flexible Electronics
DOI10.1115/1.4042920
Indexed BySCI ; EI
Language英语
WOS IDWOS:000467293900011
Classification一类/力学重要期刊
Ranking1
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/79093
Collection非线性力学国家重点实验室
Corresponding AuthorSu YW(苏业旺)
Affiliation1.State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences
2.School of Engineering Science, University of Chinese Academy of Sciences
3.Beijing Key Laboratory of Engineered Construction and Mechanobiology, Institute of Mechanics, Chinese Academy of Sciences
Recommended Citation
GB/T 7714
Yin SZ,Su YW. A traction-free model for the tensile stiffness and bending stiffness of laminated ribbons of flexible electronics[J]. Journal of Applied Mechanics,2019,86(5):051011.
APA Yin SZ,&Su YW.(2019).A traction-free model for the tensile stiffness and bending stiffness of laminated ribbons of flexible electronics.Journal of Applied Mechanics,86(5),051011.
MLA Yin SZ,et al."A traction-free model for the tensile stiffness and bending stiffness of laminated ribbons of flexible electronics".Journal of Applied Mechanics 86.5(2019):051011.
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