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Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations 期刊论文
ACTA MATERIALIA, 2016, 卷号: 108, 页码: 252-263
Authors:  Yang XS;  Wang YJ(王云江);  Wang GY;  Zhai HR;  Dai LH(戴兰宏);  Zhang TY;  Zhang, TY (reprint author), Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
View  |  Adobe PDF(4249Kb)  |  Favorite  |  View/Download:319/128  |  Submit date:2016/09/14
Stress Relaxation  Nanotwin  Copper  Hrtem  Atomistic Simulations  
Shear-band toughness of bulk metallic glasses 期刊论文
ACTA MATERIALIA, 2011, 卷号: 59, 期号: 11, 页码: 4525-4537
Authors:  Jiang MQ(蒋敏强);  Dai LH(戴兰宏);  Dai, LH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
View  |  Adobe PDF(1856Kb)  |  Favorite  |  View/Download:1015/317  |  Submit date:2012/04/01
Bulk Metallic Glass  Shear Band  Free Volume  Energy Dissipation  Toughness  Amorphous-alloys  Microstructural Evolution  Inhomogeneous Deformation  Dynamic Deformation  Fracture-toughness  Room-temperature  Forming Liquids  Behavior  Flow  Propagation