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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：346/189  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Estimation of surface equi-biaxial residual stress by using instrumented sharp indentation 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 卷号: 614, 页码: 264-272
Authors:  Lu ZK(逯智科);  Feng YH(冯义辉);  Peng GJ(彭光健);  Yang R(杨荣);  Huan Y(郇勇);  Zhang TH(张泰华);  Zhang, TH (reprint author), 18 Chaowang Rd, Hangzhou 310014, Zhejiang, Peoples R China.
View  |  Adobe PDF(3865Kb)  |  Favorite  |  View/Download：464/112  |  Submit date：2014/11/03
Mechanical-properties  Nanoindentation