|
Selected(0)Clear
Items/Page: Sort: |
| Assessment of thermo-mechanical fatigue in a nickel-based single-crystal superalloy CMSX-4 accounting for temperature gradient effects 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 809, 页码: 17
Authors: Sun JY(孙靖宇); Yang Shun; Yuan Huang
 Adobe PDF(15366Kb) |  Favorite | View/Download：351/70 | Submit date：2021/05/06
Thermal gradient mechanical fatigue (TGMF) Temperat u r e gradient Thermal-mechanical phase angle Single crystal superalloy Fatigue life model |
| Strain rate dependent shear localization and deformation mechanisms in the CrMnFeCoNi high-entropy alloy with various microstructures 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 793, 页码: 10
Authors: Yang ZL(杨正凌); Yang MX(杨沐鑫) ; Ma Y(马彦); Zhou LL(周玲玲); Cheng WQ(程文强); Yuan FP(袁福平); Wu XL(武晓雷)
Adobe PDF(13197Kb) | Favorite | View/Download：357/121 | Submit date：2020/11/30
High entropy alloys Deformation twins Shear localization Strain rate effect Strain hardening |
| Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors: Song M; Wei ZQ(魏志全); Wang BY; Chen L; Chen L; Szpunar JA
 View | Adobe PDF(5717Kb) | Favorite | View/Download：336/186 | Submit date：2019/11/27
Through-silicon via Cu protrusion Annealing temperature Electron backscatter diffraction Finite element analysis |
| Strong resistance to hydrogen embrittlement of high-entropy alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 736, 页码: 156-166
Authors: Pu Z(蒲卓); Chen Y(陈艳); Dai LH(戴兰宏)
View | Adobe PDF(6601Kb) | Favorite | View/Download：640/221 | Submit date：2018/12/12
High-entropy alloy Hydrogen embrittlement Cryogenic temperature Ductility Deformation microstructure |
